Nanofabrication Technologies

About this programme

In this course, we review the process technologies used to build integrated circuits. You will learn basic and advanced techniques to define patterns, add and remove materials on substrates. Both state-of-the-art high volume techiniques as well as technologies used in R&D are covered in the course. In the lab, we will build functional CMOS circuits from scratch using SOI wafers as starting material. Choose semester and course offering to see current information and more about the course, such as course syllabus, study period, and application information. Please note: all information from the Course syllabus is available on this page in an accessible format. The course covers process technologies that are used in micro- and nanofabrication of devices and systems on wafers. Applications include all technologies that are based on wafer scale fabrication such as integrated circuits, micro-electro-mechanical systems and optical devices. The basic unit processes deposition, patterning, etching, doping and heat treatment are covered, followed by process integration to build complex devices including statistical process control and yield models. Moore's law and the basic economics for integrated circuits are covered and examplified by reviewing the state-of-the art process technology nodes. Hands-on experience of fabricating devices in a clean room (Electrum Laboratory) and use a number of unit processes included in the course. The course gives the student basic understanding of the sustainability aspects in integrated circuit fabrication.